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Thermostable Dielectric Film Polyimide Material Substrate Amber ODM

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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

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Thermostable Dielectric Film Polyimide Material Substrate Amber ODM

Name: Thermostable Dielectric Film Polyimide Material Substrate Amber ODM
Brand: Guofeng
Price: 300 USD

Brand Name : Guofeng

Model Number : 25um

Certification : UL ISO RoHS

Place of Origin : China Hefei

MOQ : 5kg

Price : $300-$30000

Payment Terms : L/C,T/T

Supply Ability : Negotiation

Delivery Time : Negotiation

Packaging Details : Barrier+ PE foam sheet+ PE film+ Foam packing cotton

Film Appearance : The substrate must maintain nanometer-level planarity while demonstrating complete absence of topological defects, particulate inclusions, polymeric agglomerations, or extraneous contamination across its entire functional area.

Film Thickness : 25μm

Film Tensile Strengthh : 480MPa

Film Elongation at break : 40%

Film Young's Modulus : 7GPa

Film Insulation Strength : 350V/μm

Film Moisture absorption : 1425Kg/m³

Film Thermal Shrinkage(200°，2h) : 0.04%

Film Linear expansion coefficient : 8ppm

Film Moisture absorption rate : 1.8%

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GL-25(C) Advanced Thermostable Polyimide Amber Substrate
Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion-critical substrate implementations.

Key Advantages:

Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.

Product application:
Functioning as a foundational industrial component, GL-grade polyimide membrane provides critical material infrastructure for manufacturing: 1) flexible circuit protective layering systems, 2) ultra-compact interconnective components, and 3) next-generation dielectric isolation barriers.

Place of Origin:

ANHUI, CHINA

Certification:

SGS, FDA

Material:

Polyimide

Color:

Yellow

Width:

514MM, 520MM, 1028MM, 1040MM.etc

Thickness:

25μm

Packaging:

Wooden pallet

Product Features

This engineered polymer demonstrates extraordinary structural performance with exceptional fracture resistance and prolonged service life, complemented by remarkable dimensional consistency derived from its near-zero thermal expansion characteristics. The substance exhibits premium interfacial bonding capabilities ensuring fail-safe component integration, while possessing validated conformance to worldwide hazardous substance restrictions (RoHS) and chemical registration protocols (REACH). Furthermore, it maintains accredited safety validation from the recognized international testing laboratory UL.

Product Applications

Serving as pivotal enabling substrates for forthcoming electronics generations, GL-class polyimide matrices provide system-essential performance criteria throughout: 1) sub-micron tolerance bonded flexible circuit constructs, 2) dimensionally immutable barrier overlay configurations, 3) state-of-the-art semiconductor encapsulation ecosystems, and 4) function-engineered adhesive tape systems with customized viscoelastic profiles.

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Thermostable Dielectric Film Polyimide Material Substrate Amber ODM

Polyimide film

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Thermostable Dielectric Film Polyimide Material Substrate Amber ODM

Thermostable Dielectric Film Polyimide Material Substrate Amber ODM

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